Die Sorting
Si-Craft Technologies provides high-precision die sorting services designed for advanced wafer processing and backend semiconductor assembly. Our automated die sorting platforms handle wafers mounted on 8", 10", and 12" rings, supporting both standard and custom grip ring configurations. We specialize in frame-to-frame, frame-to-tray, and frame-to-gel-pak transfers, delivering consistent accuracy, die integrity, and clean handling throughout the entire sorting flow. Our systems utilize real-time wafer mapping, high-resolution vision alignment, and vacuum pick verification to ensure only good dies are selected according to the wafer map or binning file. Dies are placed into customer-specified formats such as gel-paks, waffle packs, grip rings, or JEDEC trays, maintaining full traceability from wafer to packaged component.
Our Die Sorting Capabilities
Technical Capacity
Wafer size compatibility: 6", 8", 10", and 12" mounted wafers
Ring handling: Capable of sorting 8" to 12" ring-to-ring, ring-to-grip ring, or ring-to-gel-pak/waffle pack operations
Placement accuracy: ±25 µm or better with optical and mechanical correction
Sorting modes:
Map-based (inkless) sorting from electronic wafer maps
Ink recognition (color and pattern detection)
Multi-bin classification and custom bin priority
Output carriers:
Gel-pak trays
Waffle packs
Grip rings / new mounting rings
JEDEC trays
Vacuum-release film frames
Die size range: 0.15 mm × 0.15 mm up to 15 mm × 15 mm
Environment: ESD-controlled, ISO Class 10k, 1k (for specifec applications)
Compatable with : Mems Devices, Devices with Structures like Air-Bridges
Device with an Air-Bridge
Sort At Si-Craft
Quality and Traceability
Automated die inspection: Pre- and post-pick vision check ensures die integrity
Map verification: Cross-reference with wafer map data (WF/CP) for yield accuracy
Barcode tracking: Lot, wafer, and bin data automatically recorded
Clean handling: Contactless pick using optimized vacuum and antistatic nozzles
Why Choose Si-Craft Technologies
Our die sorting services combine automated precision, flexible handling, and full data traceability, making them ideal for NPI (New Product Introduction), pilot production, or custom device packaging. Whether sorting from an 8" ring to a 12" grip ring, or transferring dies to gel-pak and waffle pack carriers, Si-Craft ensures maximum yield integrity and repeatable performance across all wafer types and die formats.
Applications
Prototype and small-volume production for advanced IC packaging
Optical, MEMS, RF, GaAs, and SiC devices requiring tight handling tolerances
R&D and specialty programs needing flexible die sort configurations
Re-sorting and re-mapping for rejected or re-binned wafers